Evana Technologies company working on advanced scribing laser technologies for hard and brittle materials (SiC, GaN, Si, Al2O3, etc. ) substrates-wafers. Laser processing of plastic . Photonics projects for biotechnology. Offer technologies and optical engines for SiC, GaN, wafer scribing (patent WO2016193786, ~14 national patents issued). SiC and GaN are materials for a new generation of high power (HP), radio frequency (RF) and LED devices. Offer technology and optical engine for silicon, sapphire and some other materials wafer scribing (patent WO2016059449, ~13 national patents issued). For the LED industry we offer the possibility to increase light output power (LOP) for high brightness (HB) and ultra-high brightness (UHB) LED. The technologies and optical engines are tunable and applicable for some other hard and brittle materials. Offer uWell Technology for high aspect ratio cold laser micro-drilling of plastic.
Currently we offer technologies and FREEZER series optical engines for silicon, silicon carbide, gallium nitride, sapphire and some other materials wafer or substrates cutting or scribing. uWell Technology for high aspect ratio cold laser micro-drilling of plastic. Optical engines based on our technologies .